The external lead finish of plastic packages used until today is an electroplate of a Tin-Lead (Sn-Pb) alloy. This alloy has been the primary finish of electronic components for many years due mainly to the reliability of solder joints and ease of manufacturing. Sn-Pb plating for plastic packages usually consists of 10-20% lead.

Lead-free means less than 1000ppm Lead in over-all composition. The common Lead-free finishes on packages with leads are as follows:

  • 100% Sn or Matte Tin
  • Tin-Bismuth (Sn-Bi)
  • Nickel-Palladium (Ni-Pd)

100% Matte Tin is the most common.


The RoHS directive took effect on 1st of July 2006 and will become law in each member state of European Union (EU). This directive restricts the use of six hazardous materials in the manufacture electronic and electrical equipment.

RoHS restricts the use of the following six substances:

  • Lead - Pb (Max 1000 ppm)
  • Cadmium - Cd (Max 100 ppm)
  • Mercury - Hg (Max 1000 ppm)
  • Hexavalent Chromium - Cr VI (Max 1000 ppm) Poly Brominated Byphenyl -
  • PBB (Max 1000 ppm)
  • Poly Brominated Dyphenyl Ether - PBDE (Max 1000 ppm)

As can bee seen from the concentrations, RoHS compliant package is Lead-Free.


Since the 28. October 2008 European Chemicals Agency (ECHA) has released a list of substance of very high concern (SVHC list). It has chemical substances (or part of a group of chemical substances) that are under the REACH regulation if used within the European Union. There are restrictions if the concentration of the substance is above 0.1% (w/w).


JIG-101, JOINT INDUSTRY GUIDE, is Material Composition Declaration for Electrotechnical Products. The document is prepared by member companies of EICTA (Europe), JGPSSI (Japan), EIA (USA) and JEDEC (USA). For further information please check http://www.jedec.org/ and search for JIG-101.

Substances used by VLSI Solution

Our objective is to combine requirements of RoHS, REACH and JIG-101 into one file and comply it. The concentration limits for products of VLSI Solution are presented in the  "Material Declaration Files" please see section "Material Declaration Files" of our Documents page. The following packages are qualified and available today from us as compliant packages. These SMD packages meet MSL Level 3 moisture sensitivity at 260oC peak reflow soldering temperature.



Mold Compound





CRM 1076NS




CRM 1076NS





Detailed material declaration files are available here. The same page has also cross section drawings and RoHS certificates.

Package reflow soldering profile (SMT components)

Our devices are qualified to meet the requirements of the preconditioning specified by JEDEC standard J-STD-020D.

Below is summary of the preconditioning. Actual board assembly profiles should be developed based on used solder paste, specific process needs, and board designs. However, settings should not exceed the preconditioning parameters of J-STD-020D.